Members of the HRL Quantum Team, Collaborators, :, Michael Abraham, Edwin Acuna, Tower S. Adams, Moonmoon Akmal, Matthew R. Alfaro
Commercially-relevant quantum computers will require large numbers of high-performing qubits that can be manufactured, integrated, and controlled at scale. Silicon exchange-only (EO) qubits are a strong candidate modality due to their control-signal simplicity and compatibility with advanced semiconductor manufacturing, but questions remain around the achievability of sufficiently low noise and a scalable control and wiring solution. Here we introduce a quantum processing unit composed of a custom-designed cryogenic CMOS controller, a novel high-density superconducting ribbon cable, and a low-noise EO qubit device. The quantum chip features a three-rail array of 54 exchange-coupled quantum dots, configurable to host up to 18 EO qubits. We integrate and use these components to demonstrate qubit performance for both single-qubit and entangling operations that advances the EO state of the art by an order of magnitude. We further validate this system by implementing a distance-5 repetition code and a quantum error detecting code then make detailed comparisons with simulations. Our approach facilitates a utility-scale quantum computer with manageable operational and capital requirements.
This paper presents a fully integrated quantum processing unit (QPU) that combines three co-designed components: a custom cryogenic CMOS controller operating at 4 K, a high-density superconducting Nb/polyimide ribbon cable, and a 54-quantum-dot silicon chip configurable to host up to 18 exchange-only (EO) qubits. The central achievement is demonstrating that these components work together as a system, achieving single-qubit gate errors of 2×10⁻⁴ and CNOT errors of 3×10⁻³ (with best reproducible CNOT at 9×10⁻⁴) — an order of magnitude improvement over prior EO qubit results. The system is validated through implementation of distance-3 and distance-5 repetition codes and a [[4,2,2]] quantum error detecting code.
The key innovation is not any single component, but the systems integration philosophy: moving all time-varying control signals to a 4 K CMOS chip, using a superconducting ribbon cable to bridge to mK qubits, and demonstrating that this architecture does not degrade qubit performance. This directly addresses the "wiring bottleneck" — widely recognized as a critical scalability challenge for semiconductor spin qubits.
The experimental methodology is thorough and multi-layered:
One notable weakness is the reliance on an "ersatz" quasi-static miscalibration parameter (Δθ/θ ~1.5%) to match simulation to experiment. While the authors are transparent about this, it means the dominant error source is not yet understood from first principles. The DEM analysis also reveals that this miscalibration model overestimates high-weight correlated errors, suggesting the real error structure is more benign but not fully captured.
Near-term impact: This work fundamentally changes the scalability narrative for silicon spin qubits. By demonstrating that cryogenic CMOS control at 4 K can drive EO qubits at mK without performance degradation, it eliminates one of the most frequently cited objections to the platform. The power consumption of ≤3.5 W is within the budget of commercial dilution refrigerators, and the superconducting ribbon cable adds only ~10 μW thermal load to the mixing chamber.
Broader impact: The systems integration approach — wafer-fabricated controller, wafer-fabricated interconnect, wafer-fabricated qubit chip — establishes a manufacturing-compatible paradigm. The 200-mm foundry process, wafer-level probing for yield, and CNN-assisted automated tune-up all point toward industrialization.
For the QEC community: The [[4,2,2]] demonstration with F_L = 0.95 after three rounds (post-selected) and the distance-5 repetition code provide benchmarks directly comparable to superconducting and trapped-ion implementations. The DEM analysis showing no statistically significant unexpected high-weight events in the [[4,2,2]] code is particularly encouraging for scalability.
This paper arrives at a critical juncture. Superconducting qubits (Google's Willow) and neutral atoms (multiple groups) have recently demonstrated QEC milestones, while silicon spin qubits have lagged in system-level demonstrations despite strong single/two-qubit metrics. This work closes that gap substantially. The concurrent progress from Intel and QuTech on silicon qubits using different architectures makes this a highly competitive moment, and the integrated control approach demonstrated here is a clear differentiator.
The EO qubit's all-electrical, all-baseband control (no microwave drives, no magnetic field gradients) is uniquely suited to cryogenic digital control, making this a natural pairing that other qubit modalities cannot easily replicate.
This is a landmark systems-integration paper that advances the state of the art for silicon exchange-only qubits by an order of magnitude while simultaneously demonstrating a scalable control architecture. The dominant remaining challenges are engineering problems (signal integrity, magnetic hygiene, calibration automation) rather than fundamental physics limitations — a strong position for a technology approaching commercialization. The work credibly positions semiconductor spin qubits as competitive with superconducting and neutral atom platforms for fault-tolerant quantum computing.
Generated Apr 20, 2026
Paper 2 addresses scalable quantum computing—one of the most consequential technological challenges of our era. It demonstrates integrated cryogenic CMOS control, novel wiring, 54 quantum dots, order-of-magnitude performance gains, and error correction codes, directly advancing utility-scale quantum computers with broad commercial and scientific implications. Paper 1 is an elegant, novel first demonstration of an on-chip RF maser with strong sensing applications, but its impact is more specialized. Paper 2's breadth, industrial relevance, methodological rigor, and alignment with the intensely active race toward fault-tolerant quantum computing give it higher potential scientific impact.
Paper 1 presents a major system-level breakthrough by integrating an 18-qubit silicon array with a cryogenic CMOS controller and demonstrating quantum error correction. This represents a significant leap toward scalable quantum computing. While Paper 2 offers an innovative approach to on-chip photonic quantum memory, its exceedingly low efficiency limits immediate practical application. Paper 1's rigorous demonstration of a highly integrated, functional QPU addresses the critical quantum scaling bottleneck, giving it a substantially higher potential for immediate and broad scientific impact.
Paper 2 likely has higher scientific impact due to its direct path to scalable, manufacturable quantum computing: integrated cryo-CMOS control, high-density wiring, and an 18-qubit silicon EO platform with order-of-magnitude performance gains plus error-coding demonstrations. This is timely and broadly relevant across quantum hardware, semiconductor engineering, and fault tolerance, with clear real-world application potential. Paper 1 is highly novel and rigorous for 3D quantum dynamics simulation and will impact computational many-body physics, but it is more specialized and less immediately translational than a scalable QPU platform.
Paper 1 demonstrates a landmark breakthrough by scaling trapped atomic resources to the 10,000-qubit scale, a first across all quantum computing platforms. The highly novel use of a single macroscopic metasurface eliminates traditional optical bottlenecks, improving laser-power efficiency and allowing practical ex-vacuum operation. While Paper 2 offers excellent full-stack integration and error-detection for silicon qubits, Paper 1 represents a more fundamental paradigm shift in overcoming physical scaling limits. The cross-disciplinary integration of metasurfaces with atomic physics to achieve unprecedented scalability will likely drive broader scientific impact.
Paper 2 likely has higher impact due to its direct relevance to scalable, commercially viable quantum computing: it integrates qubits with cryogenic CMOS control and high-density wiring, demonstrates substantially improved gate performance, and validates system-level operation via distance-5 repetition and error-detecting codes. This combination of engineering integration, manufacturability, and error-correction demonstrations has broad cross-field implications (device physics, cryo-CMOS, packaging, architecture) and strong timeliness. Paper 1 is novel and valuable for bosonic state engineering in neutral atoms, but is earlier-stage and narrower in near-term deployment.
Paper 1 likely has higher scientific impact due to strong novelty plus clear, near-term applicability: an integrated silicon EO-qubit QPU with cryo-CMOS control, scalable wiring, improved gate performance, and explicit error-code demonstrations. It addresses key bottlenecks for utility-scale quantum computing (manufacturability, integration, control, noise) with concrete system-level engineering and validation, increasing timeliness and cross-field impact (quantum info, cryoelectronics, semiconductor manufacturing). Paper 2 is highly novel and potentially transformative, but its claims are earlier-stage and higher-risk with less immediate technological deliverability.
Paper 1 likely has higher scientific impact due to its system-level advance toward scalable, manufacturable quantum computing: integrating cryo-CMOS control, high-density superconducting cabling, and a 54-dot silicon EO-qubit array, plus demonstrating improved gate performance and running distance-5 repetition/error-detecting codes. This directly addresses key bottlenecks (wiring/control/noise) for utility-scale quantum computers and can influence multiple subfields (device physics, cryo-electronics, architecture, QEC). Paper 2 is a strong metrology advance with clear applications, but its breadth and long-term platform impact are narrower.
Paper 1 presents a landmark experimental breakthrough by successfully integrating a custom cryo-CMOS controller with a 54-dot silicon qubit array. This physical demonstration of scalable hardware and error detection directly addresses the most critical bottleneck in quantum computing: manufacturing and controlling scalable qubits. While Paper 2 offers valuable theoretical benchmarks for quantum advantage, Paper 1 provides the foundational hardware advancements necessary to physically realize such theoretical milestones, promising a broader and more immediate tangible impact on developing utility-scale quantum computers.
Paper 1 has higher potential impact due to its massive leap toward practical, scalable quantum computing. While Paper 2 presents an impressive foundational advance in optical state generation, Paper 1 demonstrates a fully integrated system combining cryogenic CMOS control with a 54-quantum-dot silicon array. By successfully implementing a distance-5 repetition code and advancing the state-of-the-art for exchange-only qubits by an order of magnitude, Paper 1 addresses the critical scalability and wiring bottlenecks of quantum hardware. Its compatibility with advanced semiconductor manufacturing gives it immense real-world commercial and technological relevance.
Paper 1 likely has higher impact due to its system-level advance toward scalable, manufacturable quantum computing: integrating cryo-CMOS control, dense superconducting cabling, and a multi-qubit silicon EO device, plus demonstrating improved gate performance and running a distance-5 repetition code/error-detecting code. This directly targets a central bottleneck (scalable control/wiring and error-coded operation) with clear real-world applicability and cross-cutting relevance to quantum engineering and semiconductor integration. Paper 2 is highly novel for ultrafast quantum metrology, but its near-term application scope is narrower.